Printed Circuit Board Assembly

Enercon’s smart designs are optimized for testing, ensuring exceptional performance, total traceability, and efficient manufacturing.

Assembly

  • Automated Surface Mount Technology (SMT)
  • Ultra-fine pitch, QFP, BGA, micro-BGA, CBGA, 0201
  • Odd Form Device gripper heads
  • Board sizes up to 18” x 20” with 540 line items
  • Through-Hole Technology (THT) Selective Solder
  • RoHS and certified lead-free processing
  • No Clean processing
  • Automated Conformal Coating
  • Pin-in-Paste
  • Potting
  • IPC-A-610 Class 2 & 3