Printed Circuit Board Assembly

Enercon’s smart designs are optimized for testing, ensuring exceptional performance, total traceability, and efficient manufacturing.

Microelectronics PCB Assembly

  • Automated Surface Mount Technology (SMT)
  • Ultra-fine pitch, QFP, BGA, micro-BGA, CBGA, 0201
  • Rigid, Rigid/Flex and Flex PCB assembly
  • Package-on-Package (PoP) capable
  • Odd Form component placement
  • In-line 3D Solder Paste Inspection (SPI)
  • In-line 3D Automated Optical Inspection (AOI)
  • In-line LCR component value verification
  • RoHS and certified lead-free processing
  • No Clean processing
  • Automated Conformal Coating
  • Through-Hole Technology (THT) Selective Solder
  • Pin-in-Paste
  • Potting
  • IPC-A-610 Class 2 & 3
  • Standard Component Traceability to the individual Reference Designator