Printed Circuit Board Assembly

Enercon’s smart designs are optimized for testing, ensuring exceptional performance, total traceability, and efficient manufacturing.

Microelectronics PCB Assembly

  • Automated Surface Mount Technology (SMT)
    • Ultra-fine pitch, QFP, BGA, micro-BGA, CBGA, 0201
    • Rigid, Rigid/Flex and Flex PCB assembly
    • Package-on-Package (PoP) capable
    • Odd Form component placement
    • In-line 3D Solder Paste Inspection (SPI)
    • In-line 3D Automated Optical Inspection (AOI)
    • In-line LCR component value verification
  • Through-Hole Technology (THT)
    • Selective Solder
  • X-Ray Inspection System
  • RoHS No-Clean processing
  • IPC-A-610 Class 2 & 3
  • Automated Conformal Coating and Potting
  • Component Traceability to individual Reference Designator – Standard