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Manufacturing: Printed Circuit Board Assembly

Printed Circuit Board Assembly

Printed Circuit Board Assembly

Enercon provides high-quality printed circuit board assembly with a focus on performance, traceability, and efficient production. We support advanced SMT for fine-pitch, BGA, and PoP components on rigid, flex, and rigid-flex boards. In-line 3D inspection, X-ray, and automated soldering ensure precision, while COBOT-assisted ICT, conformal coating, and panel singulation streamline the process. Full component traceability to the reference designator comes standard, meeting the demands of complex electronic assemblies. We stay on the leading edge by continuously investing in our process engineers through ongoing training and specialized SMT coursework—because high-performance production starts with highly skilled people.

Microelectronics Printed Circuit Board Assembly (PCBA)

Automated Surface Mount Technology (SMT)

Ultra-fine pitch, QFP, BGA, micro-BGA, CBGA, 01005

Rigid, Rigid/Flex and Flex PCB assembly

Package-on-Package (PoP) capable

Odd Form component placement

In-line 3D Solder Paste Inspection (SPI)

In-line 3D Automated Optical Inspection (AOI)

In-line LCR component value verification

Through-Hole Technology (THT)

Selective Solder

Cobots and Robotic Soldering

X-Ray Inspection System
RoHS No-Clean processing
IPC-A-610 Class 2 & 3
Automated Conformal Coating and Potting
Component Traceability to individual Reference Designator – Standard